AMAOE MI-19 Stencil for Xiaomi CPU IC BGA Reballing (0.12mm)

0 /5.0 (0 reviews)
SKU 178461806513138
People are viewing right now
Pricing
Rs149 /PC
Rs176
-15%

49 available

Minimum order qty 1

QTY
seller

Inhouse product

Message Seller
  • warranty check circle Refund Available for this producte

The AMAOE MI-19 Stencil is a professional 0.12mm BGA reballing stencil developed for Xiaomi and Redmi smartphone CPU, PMIC, and motherboard IC reballing. Crafted from premium Japanese stainless steel, this stencil features precision laser-cut apertures that provide accurate solder ball alignment for reliable CPU and IC repair.

Designed for professional mobile repair technicians and electronics service centers, the MI-19 stencil offers excellent heat resistance, durability, and long service life. It is ideal for advanced motherboard repair, CPU replacement, PMIC servicing, and BGA rework on compatible Xiaomi and Redmi devices.

Key Features

  • Premium Japanese stainless steel construction
  • Precision laser-cut BGA openings
  • 0.12mm thickness for accurate solder ball placement
  • Excellent heat resistance
  • Durable and reusable
  • Professional-grade quality
  • Suitable for CPU, PMIC, Power IC, Flash IC, and motherboard IC reballing
  • Designed for Xiaomi and Redmi smartphone repair

Compatible Applications

  • Xiaomi smartphones
  • Redmi smartphones
  • Compatible Xiaomi and Redmi CPU layouts
  • PMIC, Power IC, Flash IC, and motherboard IC repair
  • Professional BGA reballing and motherboard maintenance

Reviews & Ratings

0.0

Total Review 0

No reviews found!

Product Queries (0)

Login Or Registerto submit your questions to seller

Other Questions

No queries have been asked to the seller yet

Frequently Bought Together

No frequently bought products found!
All categories
Flash Sale
Todays Deal
Auction