Amaoe MI-18 Stencil for Xiaomi Redmi CPU Reballing

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SKU 178446292482562
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The Amaoe MI-18 Stencil is a professional-grade BGA reballing stencil designed for Xiaomi and Redmi smartphone CPU and IC reballing. Made from premium Japanese stainless steel with a 0.12mm precision thickness, it delivers precise solder ball alignment for efficient CPU replacement, IC rework, and motherboard repair.

The precision square-hole layout ensures uniform solder paste application, providing consistent and reliable reballing results. Its durable, reusable construction makes it an essential tool for professional mobile repair technicians working on Xiaomi and Redmi devices.

Features:

  • Premium Japanese stainless steel construction
  • Precision 0.12mm thickness
  • High-accuracy square-hole design
  • Durable, reusable, and corrosion-resistant
  • Designed for Xiaomi and Redmi CPU reballing
  • Precise solder ball alignment
  • Ideal for professional motherboard and IC repair

Applications:

  • Xiaomi smartphone motherboard repair
  • Redmi smartphone CPU reballing
  • BGA IC replacement
  • CPU and chipset repair
  • Mobile PCB maintenance
  • Professional repair workshops

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