The Amaoe MI-18 Stencil is a professional-grade BGA reballing stencil designed for Xiaomi and Redmi smartphone CPU and IC reballing. Made from premium Japanese stainless steel with a 0.12mm precision thickness, it delivers precise solder ball alignment for efficient CPU replacement, IC rework, and motherboard repair.
The precision square-hole layout ensures uniform solder paste application, providing consistent and reliable reballing results. Its durable, reusable construction makes it an essential tool for professional mobile repair technicians working on Xiaomi and Redmi devices.
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