AMAOE MI-17 BGA Reballing Stencil for Redmi, Poco & MediaTek IC Repair

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SKU 178401530929000
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The AMAOE MI-17 BGA Reballing Stencil is a premium-quality stainless steel stencil designed for professional mobile phone motherboard and IC repair. Manufactured from high-grade Japanese steel with a 0.12mm thickness, it provides precise solder paste application and accurate BGA reballing for MediaTek ICs and supported Redmi and POCO smartphones.

Its precision laser-cut apertures ensure perfect alignment during chip-level repairs, making it an essential tool for technicians performing motherboard rework, CPU reballing, and SMD soldering. The stencil is reusable, durable, heat-resistant, and ideal for daily professional repair work.

Compatible Models & ICs:

  • Redmi Note 10
  • Redmi Note 10 Pro
  • Redmi Note 11
  • Redmi Note 11 Pro+
  • Redmi Note 12 Pro
  • Redmi Note 12 Pro+
  • Redmi K40
  • POCO M3 Pro
  • POCO M4 Pro
  • POCO X3 GT
  • MT6315GP
  • MT6190W
  • MT6190MV
  • MT6359 / MT6365
  • MT6360
  • MT6891Z / MT6893Z
  • MT6877V
  • MT6833V
  • BQ25980
  • MT6635XP
  • And other compatible MediaTek BGA ICs.

Features

  • High-quality Japanese stainless steel construction
  • 0.12mm precision thickness
  • Square aperture design for accurate solder paste printing
  • Reusable and heat resistant
  • Ideal for BGA IC reballing and motherboard repair
  • Professional-grade tool for mobile repair technicians

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