The AMAOE MI-17 BGA Reballing Stencil is a premium-quality stainless steel stencil designed for professional mobile phone motherboard and IC repair. Manufactured from high-grade Japanese steel with a 0.12mm thickness, it provides precise solder paste application and accurate BGA reballing for MediaTek ICs and supported Redmi and POCO smartphones.
Its precision laser-cut apertures ensure perfect alignment during chip-level repairs, making it an essential tool for technicians performing motherboard rework, CPU reballing, and SMD soldering. The stencil is reusable, durable, heat-resistant, and ideal for daily professional repair work.
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