AMAOE MI-16 Stencil for Xiaomi Redmi K50 Ultra / Xiaomi 12T Pro CPU IC BGA Reballing (0.12mm)

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SKU 178454650546455
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The AMAOE MI-16 Stencil is a premium 0.12mm BGA reballing stencil specially designed for Xiaomi Redmi K50 Ultra, Xiaomi 12T Pro, and compatible Qualcomm CPU & IC layouts. Manufactured from high-quality Japanese stainless steel, this stencil features precision laser-cut holes that ensure accurate solder ball placement for reliable CPU and IC reballing.

Ideal for professional mobile repair technicians and service centers, the MI-16 stencil offers excellent heat resistance, long-lasting durability, and high reusability. It is an essential tool for repairing Xiaomi and Redmi smartphone motherboards with precision and efficiency.

Features

  • Premium Japanese stainless steel construction
  • Precision laser-cut BGA hole design
  • 0.12mm thickness for accurate solder ball placement
  • High-temperature resistant
  • Durable and reusable
  • Professional-grade quality
  • Ideal for CPU, PMIC, and IC reballing
  • Suitable for Xiaomi and Redmi motherboard repair

Compatible Models

  • Xiaomi 12T Pro
  • Redmi K50 Ultra
  • Qualcomm Snapdragon-based Xiaomi devices (compatible layouts)
  • CPU, PMIC, and supporting motherboard ICs matching the MI-16 stencil design

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