The AMAOE MI-14 Stencil is a premium 0.12mm BGA reballing stencil specially designed for Xiaomi Mi 11, Mi 11 Ultra, Mi 11 Pro, Mi 11X Pro, Redmi K40 Pro, and other compatible Snapdragon 888 motherboard layouts. Manufactured from premium Japanese stainless steel, this stencil features precision laser-cut apertures that ensure accurate solder ball placement for professional CPU and IC reballing.
Designed for mobile repair technicians and electronics service centers, the MI-14 stencil provides excellent heat resistance, long-lasting durability, and consistent performance during motherboard repair. It is ideal for CPU replacement, PMIC repair, Flash IC rework, and advanced BGA maintenance on Xiaomi and Redmi smartphones.
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