AMAOE MI-14 Stencil for Xiaomi Mi 11, Mi 11 Ultra, Mi 11 Pro, Mi 11X Pro & Redmi K40 Pro CPU IC BGA Reballing (0.12mm)

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SKU 178455115050985
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The AMAOE MI-14 Stencil is a premium 0.12mm BGA reballing stencil specially designed for Xiaomi Mi 11, Mi 11 Ultra, Mi 11 Pro, Mi 11X Pro, Redmi K40 Pro, and other compatible Snapdragon 888 motherboard layouts. Manufactured from premium Japanese stainless steel, this stencil features precision laser-cut apertures that ensure accurate solder ball placement for professional CPU and IC reballing.

Designed for mobile repair technicians and electronics service centers, the MI-14 stencil provides excellent heat resistance, long-lasting durability, and consistent performance during motherboard repair. It is ideal for CPU replacement, PMIC repair, Flash IC rework, and advanced BGA maintenance on Xiaomi and Redmi smartphones.

Features

  • Premium Japanese stainless steel construction
  • Precision laser-cut BGA openings
  • 0.12mm thickness for accurate solder ball placement
  • High-temperature resistant
  • Durable and reusable
  • Professional-grade quality
  • Suitable for CPU, PMIC, Flash IC, and motherboard IC reballing
  • Designed for Xiaomi and Redmi motherboard repair

Compatible Models

  • Xiaomi Mi 11
  • Xiaomi Mi 11 Ultra
  • Xiaomi Mi 11 Pro
  • Xiaomi Mi 11X Pro
  • Redmi K40 Pro
  • Qualcomm Snapdragon 888 CPU and compatible IC layouts
  • Suitable for professional motherboard BGA reballing and repair 

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