AMAOE MI-13 BGA Reballing Stencil for Redmi Note 9 & Redmi Note 9 Pro

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SKU 178401464123028
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The AMAOE MI-13 BGA Reballing Stencil is a precision-engineered repair stencil designed for the Redmi Note 9 and Redmi Note 9 Pro smartphones. Made from premium stainless steel, it provides accurate alignment for BGA IC reballing, solder ball placement, and motherboard-level repairs.

With its precision laser-cut hole pattern, the stencil delivers consistent soldering performance and helps reduce alignment errors during chip-level servicing. Its durable, heat-resistant, and reusable design makes it an essential tool for professional mobile repair technicians.

Key Features:

  • Compatible with Redmi Note 9 and Redmi Note 9 Pro
  • Model: AMAOE MI-13
  • Premium stainless steel construction
  • Precision laser-cut BGA hole pattern
  • Ideal for IC reballing and motherboard repair
  • Heat-resistant, durable, and reusable
  • Suitable for professional mobile repair workshops
  • Designed for accurate chip-level mobile phone repairs 

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