The Amaoe MI 11 Ultra & 11 Pro Middle Layer Reballing Stencil (0.12mm) is a professional-grade BGA reballing stencil designed specifically for Xiaomi Mi 11 Ultra and Xiaomi Mi 11 Pro smartphone motherboard repairs. Manufactured from premium Japanese stainless steel, this stencil features precision laser-cut openings for accurate solder ball placement and reliable middle-layer reballing.
With a 0.12 mm thickness, it delivers excellent stability, heat resistance, and durability, making it suitable for repeated professional use. The stencil is ideal for motherboard restoration, CPU and BGA IC rework, and advanced PCB maintenance, helping technicians perform accurate chip-level repairs with improved efficiency.
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