AMAOE MI-11 Stencil for Xiaomi Mi & Redmi Motherboard Repair

The AMAOE MI-11 Stencil for Xiaomi Mi & Redmi is a professional 0.12mm BGA reballing stencil designed for accurate CPU IC and motherboard repairs on compatible Xiaomi Mi and Redmi smartphones. Manufactured from premium Japanese stainless steel, it offers exceptional durability, precise solder ball alignment, and consistent performance for professional chip-level repair work.

Featuring a precision square-hole design, the stencil ensures uniform solder ball placement, making BGA reballing faster, cleaner, and more reliable. It is heat-resistant, reusable, and ideal for mobile repair shops, service centers, and technicians performing advanced motherboard repairs.

Whether you are replacing CPU ICs or restoring damaged Xiaomi and Redmi motherboards, the AMAOE MI-11 Stencil provides the precision and reliability required for professional results.

Key Features

• Premium Japanese stainless steel construction
• Precision 0.12mm thickness
• Designed for Xiaomi Mi & Redmi CPU IC reballing
• High-precision square-hole design
• Accurate solder ball positioning
• Heat-resistant and reusable
• Durable and corrosion-resistant
• Professional-grade BGA reballing stencil
• Ideal for chip-level smartphone motherboard repair

Compatible Devices

• Compatible with supported Xiaomi Mi smartphones
• Compatible with supported Redmi smartphones
• Designed for corresponding CPU and motherboard IC layouts as specified by the manufacturer