AMAOE M12P-012 0.12mm Middle Layer BGA Reballing Stencil for Xiaomi 12 Pro

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SKU 178401201623278
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The AMAOE M12P-012 0.12mm Middle Layer BGA Reballing Stencil is specially designed for the Xiaomi 12 Pro smartphone motherboard. Manufactured from premium-grade stainless steel, this precision stencil provides accurate alignment for BGA IC reballing, solder ball placement, and motherboard-level repairs.

Featuring a precision laser-cut hole pattern with a 0.12mm thickness, the stencil ensures consistent soldering performance while minimizing alignment errors during chip-level servicing. Its heat-resistant and reusable construction makes it ideal for professional technicians working on Xiaomi smartphone repairs.

Key Features:

  • Compatible with Xiaomi 12 Pro
  • Model: AMAOE M12P-012
  • 0.12mm precision middle layer BGA stencil
  • High-quality stainless steel construction
  • Precision laser-cut hole design
  • Heat-resistant, durable, and reusable
  • Ideal for IC reballing, solder ball planting, and motherboard repair
  • Suitable for professional mobile repair workshops 

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