AMAOE LPDDR-5 Stencil for eMMC, eMCP, UFS & LPDDR Memory IC Reballing

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SKU 178435965480806
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The AMAOE LPDDR-5 Stencil is a professional BGA reballing stencil designed for LPDDR5 memory ICs, eMMC, eMCP, and UFS chip repair. Manufactured from premium Japanese steel, this stencil features a precision laser-cut square-hole design that ensures accurate solder ball placement and consistent solder paste application for chip-level repairs.

Built for professional mobile phone technicians, the stencil is reusable, heat-resistant, and highly durable, making it ideal for reballing memory chips used in smartphones, tablets, and other electronic devices. Its precise aperture layout helps achieve reliable solder joints while reducing repair time and improving overall repair quality. The stencil is manufactured from Japanese steel, features square apertures, is reusable, and has a 0.15mm thickness.

Features:

  • Designed for LPDDR5, eMMC, eMCP, and UFS memory IC reballing.
  • Premium Japanese steel construction.
  • Precision 0.15mm thickness.
  • High-precision laser-cut square-hole design.
  • Heat-resistant, corrosion-resistant, and reusable.
  • Provides accurate solder ball alignment for BGA chip repair.
  • Ideal for professional mobile motherboard repair and IC rework. 

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