The Amaoe iQOO 12 Pro Middle Layer Reballing Stencil (0.12mm) is a professional-grade BGA reballing stencil designed specifically for the iQOO 12 Pro smartphone. Crafted from premium Japanese stainless steel, it features precision laser-cut openings that ensure accurate solder ball placement for reliable middle-layer motherboard repairs.
With a 0.12 mm thickness, this stencil provides excellent heat resistance, dimensional stability, and durability for repeated professional use. It is ideal for chip-level motherboard repair, CPU and BGA IC rework, and advanced PCB maintenance. The reusable design helps technicians perform precise soldering and achieve consistent, high-quality repair results.
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