The Amaoe iQOO 10 Pro Middle Layer Reballing Stencil (0.12mm) is a high-precision BGA reballing stencil specially designed for iQOO 10 Pro smartphone motherboard repair. Made from premium Japanese stainless steel, this stencil features precision laser-cut openings that provide accurate solder ball placement, ensuring reliable and efficient middle-layer reballing.
With its 0.12 mm thickness, the stencil offers excellent heat resistance, dimensional stability, and durability for repeated professional use. It is ideal for motherboard restoration, CPU and BGA IC rework, and advanced PCB maintenance. The reusable design enables technicians to perform precise chip-level repairs with improved accuracy and efficiency.
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