The Amaoe iPhone 16e Middle Layer BGA Reballing Stencil (0.12mm) is a professional-grade stencil designed for iPhone 16e logic board and middle-layer motherboard repairs. Manufactured from premium Japanese stainless steel, it features precision laser-cut apertures that ensure accurate solder ball placement for reliable BGA reballing and chip-level repairs.
With a 0.12 mm thickness, this stencil provides excellent heat resistance, durability, and dimensional stability, making it suitable for repeated professional use. It is ideal for middle-layer motherboard restoration, CPU and IC rework, and precision PCB maintenance. Designed for repair technicians, it delivers consistent alignment and improves repair efficiency.
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