Amaoe iPhone 16e Middle Layer BGA Reballing Stencil (0.12mm)

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SKU 178400735935796
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The Amaoe iPhone 16e Middle Layer BGA Reballing Stencil (0.12mm) is a professional-grade stencil designed for iPhone 16e logic board and middle-layer motherboard repairs. Manufactured from premium Japanese stainless steel, it features precision laser-cut apertures that ensure accurate solder ball placement for reliable BGA reballing and chip-level repairs.

With a 0.12 mm thickness, this stencil provides excellent heat resistance, durability, and dimensional stability, making it suitable for repeated professional use. It is ideal for middle-layer motherboard restoration, CPU and IC rework, and precision PCB maintenance. Designed for repair technicians, it delivers consistent alignment and improves repair efficiency.

Key Features

  • Specially designed for Apple iPhone 16e middle-layer motherboard repair
  • Precision laser-cut stainless steel construction
  • 0.12 mm thickness for accurate BGA reballing
  • Premium Japanese stainless steel for long service life
  • Heat-resistant, reusable, and easy to clean
  • Ensures precise solder ball alignment and placement
  • Ideal for logic board, CPU, and IC chip repairs
  • Suitable for professional mobile repair technicians and service centers

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