Amaoe iPhone 14 Plus BGA Reballing Stencil (0.12mm)

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SKU 178400775155921
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The Amaoe iPhone 14 Plus BGA Reballing Stencil (0.12mm) is a high-precision stencil designed for Apple iPhone 14 Plus motherboard and logic board repair. Manufactured from premium Japanese stainless steel, it features precision laser-cut openings that ensure accurate solder ball placement for professional BGA reballing and IC repair.

With a 0.12 mm thickness, the stencil provides excellent heat resistance, durability, and dimensional stability, making it ideal for repeated professional use. It is designed for chip-level motherboard maintenance, CPU and IC rework, and precision PCB repairs. The reusable design helps technicians achieve accurate alignment, efficient soldering, and reliable repair results.

Key Features

  • Specifically designed for Apple iPhone 14 Plus motherboard repair
  • Precision BGA reballing stencil with laser-cut openings
  • Premium Japanese stainless steel construction
  • 0.12 mm thickness for accurate solder ball placement
  • Heat-resistant, durable, and reusable
  • Suitable for logic board, CPU, and IC chip repair
  • Easy to align for precise motherboard rework
  • Ideal for professional mobile repair technicians and service centers

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