AMAOE IPDY-1 Stencil for iPhone Dot Matrix IC Reballing

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SKU 178429286900224
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The AMAOE IPDY-1 Stencil is a high-precision BGA reballing stencil designed for repairing iPhone Dot Matrix (Face ID) ICs. Made from premium Japanese stainless steel with a 0.12mm thickness, it provides precise alignment for solder balls during IC reballing, ensuring reliable and professional repair results.

This stencil is ideal for technicians performing Face ID, Dot Projector, and other precision iPhone motherboard repairs. Its durable, reusable design withstands repeated use while maintaining excellent accuracy for solder paste application and BGA chip rework. AMAOE stencils are known for their precision, super-hard Japanese steel construction, square hole design, and long service life.

Features:

  • Designed for iPhone Dot Matrix (Face ID) IC reballing
  • High-quality Japanese stainless steel
  • 0.12mm ultra-precision thickness
  • Accurate square-hole design for uniform solder ball placement
  • Reusable, corrosion-resistant, and durable
  • Suitable for professional mobile phone motherboard repair
  • Ideal for BGA IC reballing and precision soldering work

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