The AMAOE IP16 / IP16 Plus Layer Stencil (0.12mm) is a professional BGA reballing stencil designed for iPhone 16 and iPhone 16 Plus motherboard and middle-layer repair. Manufactured from premium 0.12mm stainless steel, it features precision laser-cut openings that provide accurate solder ball alignment and uniform solder paste application for dependable chip-level repairs.
This reusable stencil is ideal for IC reballing, CPU repair, motherboard restoration, and PCB maintenance. Its durable, heat-resistant, and corrosion-resistant construction ensures long service life, making it an essential tool for professional mobile repair technicians and service centers.
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