AMAOE IP14 Plus Layer Stencil

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SKU 178402033327242
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The AMAOE IP14 Plus Layer Stencil is a premium-quality BGA reballing stencil specially designed for iPhone 14 Plus motherboard middle-layer repair. Manufactured from durable Japanese stainless steel with a precision 0.12mm thickness, it provides accurate solder paste placement and reliable alignment for professional chip-level repairs.

Its reusable construction ensures long service life, making it an essential tool for mobile repair technicians performing motherboard reballing, PCB maintenance, and IC replacement.

Features:

  • Designed specifically for iPhone 14 Plus layer/middle board repair
  • High-quality Japanese stainless steel construction
  • Precision laser-cut holes for accurate solder paste application
  • 0.12mm thickness for professional BGA reballing
  • Reusable and corrosion-resistant
  • Suitable for motherboard and IC repair
  • Ideal for mobile repair shops and technicians 

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