AMAOE IP11 Layer Stencil

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SKU 178403281064189
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The AMAOE IP11 Layer Stencil is a high-precision BGA reballing stencil specially designed for iPhone 11 motherboard and middle-layer repair. Made from premium 0.12mm stainless steel, it features precision laser-cut openings that ensure accurate solder ball alignment and even solder paste application, delivering reliable results for professional chip-level repairs.

This reusable stencil is ideal for IC reballing, CPU repairs, motherboard maintenance, and PCB restoration. Its durable, heat-resistant, and corrosion-resistant design makes it an essential tool for mobile phone repair technicians and service centers.

Key Features:

  • Designed specifically for iPhone 11 motherboard repair
  • Premium 0.12mm stainless steel construction
  • Precision laser-cut holes for accurate BGA reballing
  • Reusable and highly durable
  • Heat and corrosion resistant
  • Ideal for IC, CPU, and motherboard repair
  • Suitable for professional mobile repair technicians

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