The AMAOE IP11 Layer Stencil is a high-precision BGA reballing stencil specially designed for iPhone 11 motherboard and middle-layer repair. Made from premium 0.12mm stainless steel, it features precision laser-cut openings that ensure accurate solder ball alignment and even solder paste application, delivering reliable results for professional chip-level repairs.
This reusable stencil is ideal for IC reballing, CPU repairs, motherboard maintenance, and PCB restoration. Its durable, heat-resistant, and corrosion-resistant design makes it an essential tool for mobile phone repair technicians and service centers.
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