AMAOE HW-7 Stencil for Honor & Huawei

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SKU 178411205813951
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Rs149 /PC
Rs176
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The AMAOE HW-7 Stencil is a professional-grade BGA reballing stencil designed for Honor and Huawei smartphone CPU IC repair. Manufactured from premium Japanese stainless steel with precision laser-cut square holes, it provides accurate solder ball placement for efficient CPU reballing and motherboard repair.

Built with a 0.12mm thickness, the HW-7 stencil is durable, heat-resistant, and reusable, making it an ideal tool for mobile phone repair professionals. Its precision design ensures stable alignment, clean solder joints, and reliable repair results during CPU IC replacement.

Key Features:

  • Premium Japanese stainless steel construction
  • Precision laser-cut square-hole design
  • 0.12mm thickness for precise reballing
  • High-temperature resistant and reusable
  • Accurate CPU IC alignment
  • Designed for Honor & Huawei smartphone motherboard repair
  • Ideal for professional GSM and mobile repair technicians

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