The AMAOE HW-7 Stencil is a professional-grade BGA reballing stencil designed for Honor and Huawei smartphone CPU IC repair. Manufactured from premium Japanese stainless steel with precision laser-cut square holes, it provides accurate solder ball placement for efficient CPU reballing and motherboard repair.
Built with a 0.12mm thickness, the HW-7 stencil is durable, heat-resistant, and reusable, making it an ideal tool for mobile phone repair professionals. Its precision design ensures stable alignment, clean solder joints, and reliable repair results during CPU IC replacement.
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