AMAOE HW-4 Stencil for Honor & Huawei IC Reballing

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SKU 178410238194623
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AMAOE HW-4 Stencil for Honor & Huawei IC Reballing is a premium-quality 0.12mm stainless steel BGA stencil designed for precise reballing and repair of Huawei and Honor motherboard ICs. Its square-hole design ensures accurate solder paste application, resulting in clean and reliable solder joints for professional mobile phone repairs.

Manufactured from high-quality Japanese steel, the stencil is durable, reusable, and resistant to deformation, making it ideal for daily use by mobile repair technicians and service centers.

Compatible Models & ICs:

  • HI6220
  • 6250 CPU
  • MSM8952 CPU
  • Huawei P8
  • Huawei P9
  • Honor 4G
  • Honor 4X
  • Honor 4C
  • Honor 5C
  • Honor 5A

Key Features:

  • Premium Japanese stainless steel
  • 0.12mm thickness for precise reballing
  • Square-hole design for accurate solder paste deposition
  • Reusable and long-lasting
  • Ideal for Huawei & Honor motherboard IC repair
  • Suitable for professional mobile repair technicians 

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