AMAOE HW-18 Stencil for Honor & Huawei

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SKU 178411158589009
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The AMAOE HW-18 Stencil is a high-precision BGA reballing stencil designed for Honor and Huawei smartphone CPU IC repair. Crafted from premium Japanese stainless steel with precision laser-cut square holes, it delivers accurate solder ball alignment for reliable CPU reballing and motherboard maintenance.

With a 0.12mm thickness, the HW-18 stencil offers excellent durability, heat resistance, and repeated usability. It is an essential tool for professional mobile repair technicians who require precise and efficient IC reballing during smartphone motherboard repairs.

Key Features:

  • Premium Japanese stainless steel construction
  • Precision laser-cut square-hole design
  • 0.12mm thickness for accurate BGA reballing
  • High-temperature resistant and reusable
  • Ensures precise CPU IC alignment
  • Designed for Honor & Huawei smartphone motherboard repair
  • Ideal for professional GSM and mobile repair technicians

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