AMAOE HW-16 Stencil for Honor & Huawei

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SKU 178411072866021
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The AMAOE HW-16 Stencil is a premium-quality BGA reballing stencil specially designed for Honor and Huawei smartphone CPU ICs. Made from high-grade Japanese stainless steel with precision laser-cut square holes, it ensures accurate solder ball placement for efficient CPU reballing and motherboard repair.

Its 0.12mm thickness provides excellent durability, heat resistance, and long-lasting performance, making it an ideal tool for professional mobile repair technicians. The reusable design delivers precise alignment and reliable soldering results for advanced motherboard repairs.

Key Features:

  • Premium Japanese stainless steel construction
  • Precision laser-cut square-hole design
  • 0.12mm thickness for accurate reballing
  • High-temperature resistant and reusable
  • Precise alignment for CPU IC repair
  • Ideal for Honor & Huawei motherboard maintenance
  • Suitable for professional GSM and mobile repair technicians

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