AMAOE HW-11 Stencil for Honor & Huawei

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SKU 178411040273614
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The AMAOE HW-11 Stencil is a professional BGA reballing stencil specially designed for Honor and Huawei smartphone CPU IC repair. Manufactured from premium Japanese steel with precision laser-cut square holes, it ensures accurate solder ball alignment and consistent reballing results for mobile motherboard repairs.

With a 0.12mm thickness, this stencil is highly durable, reusable, and resistant to high temperatures, making it ideal for professional technicians performing CPU IC replacement and motherboard maintenance.

Features:

  • Premium Japanese steel construction
  • Precision laser-cut square-hole design
  • 0.12mm thickness
  • Super hard and reusable
  • High-temperature resistant
  • Accurate BGA CPU reballing
  • Suitable for Honor & Huawei motherboard repair
  • Ideal for professional mobile repair technicians 

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