AMAOE HW-10 Stencil for Honor & Huawei

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SKU 178411329466772
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The AMAOE HW-10 Stencil is a premium BGA reballing stencil specially designed for Honor and Huawei smartphone CPU IC repair. Crafted from high-quality Japanese stainless steel with precision laser-cut square holes, it ensures accurate solder ball placement and stable IC alignment for professional motherboard repairs.

Featuring a 0.12mm thickness, the HW-10 stencil offers excellent durability, heat resistance, and reusability. It is an essential tool for technicians performing CPU reballing, IC replacement, and advanced mobile motherboard maintenance.

Key Features:

  • Premium Japanese stainless steel construction
  • Precision laser-cut square-hole design
  • 0.12mm thickness for precise BGA reballing
  • High-temperature resistant and reusable
  • Accurate CPU IC alignment
  • Designed for Honor & Huawei smartphone motherboard repair
  • Ideal for professional GSM and mobile repair technicians

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