The AMAOE GWIFI-1 Stencil is a professional-grade BGA reballing stencil specially designed for Google Phone WiFi IC repair and reballing. Manufactured from premium Japanese stainless steel with a 0.12mm thickness, it provides precise solder ball alignment for accurate and reliable chip-level repairs. The stencil is reusable, heat-resistant, and engineered for consistent performance in professional mobile repair workshops.
Ideal for Google Pixel motherboard repair, the GWIFI-1 stencil enables technicians to perform WiFi IC reballing, solder paste application, and BGA chip replacement with greater precision and efficiency.
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