AMAOE GWIFI-1 Stencil for Google Phone WiFi IC Reballing

0 /5.0 (0 reviews)
SKU 178429319717615
People are viewing right now
Pricing
Rs149 /PC
Rs176
-15%

50 available

Minimum order qty 1

QTY
seller

Inhouse product

Message Seller
  • warranty check circle Refund Available for this producte

The AMAOE GWIFI-1 Stencil is a professional-grade BGA reballing stencil specially designed for Google Phone WiFi IC repair and reballing. Manufactured from premium Japanese stainless steel with a 0.12mm thickness, it provides precise solder ball alignment for accurate and reliable chip-level repairs. The stencil is reusable, heat-resistant, and engineered for consistent performance in professional mobile repair workshops.

Ideal for Google Pixel motherboard repair, the GWIFI-1 stencil enables technicians to perform WiFi IC reballing, solder paste application, and BGA chip replacement with greater precision and efficiency.

Features:

  • Designed for Google Phone WiFi IC reballing.
  • High-quality Japanese stainless steel construction.
  • Ultra-precision 0.12mm thickness.
  • Square-hole design for accurate solder ball placement.
  • Heat-resistant, corrosion-resistant, and reusable.
  • Suitable for professional BGA and SMD repair work.
  • Delivers clean solder joints and reliable repair results. 

Reviews & Ratings

0.0

Total Review 0

No reviews found!

Product Queries (0)

Login Or Registerto submit your questions to seller

Other Questions

No queries have been asked to the seller yet

Frequently Bought Together

No frequently bought products found!
All categories
Flash Sale
Todays Deal
Auction