AMAOE EU-5 Stencil for Samsung Exynos CPU IC BGA Reballing (0.12mm)

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SKU 178461739165421
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The AMAOE EU-5 Stencil is a premium 0.12mm BGA reballing stencil specially designed for Samsung Exynos CPU and compatible motherboard IC reballing. Manufactured from high-quality Japanese stainless steel, this precision stencil features laser-cut apertures that ensure accurate solder ball placement for professional CPU, PMIC, and IC repair.

Built for mobile repair technicians, electronics service centers, and motherboard repair professionals, the EU-5 stencil delivers exceptional heat resistance, durability, and long-lasting performance. It is ideal for repairing Samsung smartphones powered by Exynos processors and provides reliable results during advanced BGA rework.

Key Features

  • Premium Japanese stainless steel construction
  • Precision laser-cut BGA openings
  • 0.12mm thickness for accurate solder ball placement
  • Excellent heat resistance
  • Durable and reusable
  • Professional-grade quality
  • Designed for Samsung Exynos CPU reballing
  • Suitable for CPU, PMIC, Power IC, and motherboard IC repair

Compatible Applications

  • Samsung Exynos CPU series
  • Samsung Exynos motherboard IC layouts
  • CPU reballing and replacement
  • PMIC and Power IC repair
  • Professional smartphone motherboard maintenance
  • Advanced BGA rework and IC repair 

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