Amaoe EU-4 Stencil for HiSilicon CPU Reballing

0 /5.0 (0 reviews)
SKU 178446097912196
People are viewing right now
Pricing
Rs149 /PC
Rs176
-15%

50 available

Minimum order qty 1

QTY
seller

Inhouse product

Message Seller
  • warranty check circle Refund Available for this producte

The Amaoe EU-4 Stencil is a professional-grade BGA reballing stencil designed for Huawei HiSilicon Kirin CPU and IC reballing. Manufactured from premium Japanese stainless steel with a 0.12mm precision thickness, it ensures accurate solder ball alignment for reliable CPU repair and motherboard maintenance.

Its precision square-hole design provides even solder paste distribution, making it ideal for CPU replacement, BGA IC rework, and advanced motherboard repairs. Built for durability and repeated professional use, the EU-4 stencil delivers consistent, high-precision results for mobile repair technicians.

Features:

  • Premium Japanese stainless steel construction
  • Precision 0.12mm thickness
  • High-accuracy square-hole design
  • Durable, reusable, and corrosion-resistant
  • Designed for Huawei HiSilicon Kirin CPU reballing
  • Precise solder ball alignment
  • Ideal for professional motherboard and IC repair

Applications:

  • Huawei smartphone motherboard repair
  • HiSilicon Kirin CPU reballing
  • BGA IC replacement
  • CPU and chipset repair
  • Mobile PCB maintenance
  • Professional mobile repair workshops

Reviews & Ratings

0.0

Total Review 0

No reviews found!

Product Queries (0)

Login Or Registerto submit your questions to seller

Other Questions

No queries have been asked to the seller yet

Frequently Bought Together

No frequently bought products found!
All categories
Flash Sale
Todays Deal
Auction