AMAOE EU-1 Universal BGA Reballing Stencil

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SKU 178437017445873
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 The AMAOE EU-1 Stencil is a professional universal BGA reballing stencil designed for precision chip-level repair and IC reballing. Manufactured from super-hard Japanese steel with a 0.12mm thickness, it provides accurate solder ball alignment and uniform solder paste application for reliable BGA rework. The stencil features precision square-hole apertures for clean solder ball formation and is suitable for repeated professional use.

Ideal for mobile phone repair technicians, the EU-1 stencil can be used for a wide range of CPU, IC, and motherboard repair applications. Its heat-resistant and corrosion-resistant construction ensures durability and consistent performance in repair workshops.

Features:

  • Universal BGA stencil for CPU and IC reballing.
  • Premium Japanese steel construction.
  • Precision 0.12mm thickness.
  • High-precision square-hole design.
  • Heat-resistant, corrosion-resistant, and reusable.
  • Accurate solder ball alignment for chip-level repairs.
  • Ideal for professional mobile motherboard repair and electronics servicing. 

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