AMAOE EMMC-3 0.12mm Stencil for eMMC IC Reballing

The AMAOE EMMC-3 0.12mm Stencil is a professional-grade BGA reballing stencil designed for repairing and reballing eMMC (Embedded MultiMediaCard) memory ICs used in smartphones, tablets, and other electronic devices. Manufactured from premium Japanese stainless steel with a precision 0.12mm thickness, it ensures accurate solder ball placement, excellent durability, and reliable performance for professional chip-level repairs.

Featuring a precision square-hole layout, the stencil delivers uniform solder distribution for clean and accurate reballing results. Its heat-resistant and reusable construction makes it an essential tool for mobile repair technicians, service centers, and electronics professionals working on eMMC storage IC replacement and motherboard repairs.

The AMAOE EMMC-3 Stencil is ideal for repairing damaged eMMC chips, restoring storage functionality, and performing advanced BGA rework on mobile devices.

Key Features

• Premium Japanese stainless steel construction
• Precision 0.12mm thickness
• Designed for eMMC memory IC reballing
• High-precision square-hole design
• Accurate solder ball positioning
• Heat-resistant and reusable
• Corrosion-resistant and durable
• Professional-grade BGA repair stencil
• Suitable for smartphone, tablet, and embedded storage IC repair

Applications

• eMMC Memory IC Reballing
• Smartphone Motherboard Repair
• Tablet Motherboard Repair
• Embedded Storage IC Repair
• BGA IC Rework
• Chip-Level Mobile Repair
• Professional Electronics Repair