Amaoe EMMC-2 Stencil for eMMC, eMCP & UFS IC Reballing

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SKU 178445723710471
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The Amaoe EMMC-2 Stencil is a professional-grade BGA reballing stencil designed for eMMC, eMCP, and UFS memory ICs used in smartphones and tablets. Manufactured from premium Japanese stainless steel with a 0.12mm precision thickness, it provides accurate solder ball placement for reliable memory chip reballing and motherboard repair.

Its precision square-hole design ensures uniform solder paste distribution, making it ideal for storage IC replacement, flash memory repair, and advanced BGA rework. The durable and reusable construction delivers consistent performance for professional mobile repair technicians.

Features:

  • Premium Japanese stainless steel construction
  • Precision 0.12mm thickness
  • High-accuracy square-hole design
  • Durable, reusable, and corrosion-resistant
  • Designed for eMMC, eMCP, and UFS memory IC reballing
  • Ensures precise solder ball alignment
  • Ideal for professional motherboard and storage IC repair

Applications:

  • eMMC memory IC reballing
  • eMCP chip repair
  • UFS storage IC reballing
  • Smartphone motherboard repair
  • BGA IC replacement
  • Mobile PCB maintenance
  • Professional repair workshops

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