AMAOE E8835 Stencil for HiSilicon Kirin E8835 CPU Reballing

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SKU 178429339570026
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The AMAOE E8835 Stencil is a high-precision BGA reballing stencil designed for HiSilicon Kirin E8835 CPU chip repair and reballing. Manufactured from premium Japanese stainless steel with a precision 0.12mm thickness, it provides accurate solder ball positioning for reliable and professional motherboard repairs.

This stencil is ideal for mobile repair technicians performing CPU reballing, chip replacement, and solder paste application on HiSilicon Kirin chipsets. Its durable, reusable construction ensures long service life while maintaining excellent alignment and repair accuracy.

Features:

  • Designed for HiSilicon Kirin E8835 CPU reballing.
  • Premium Japanese stainless steel construction.
  • Precision 0.12mm thickness for accurate solder ball alignment.
  • High hardness, heat-resistant, and corrosion-resistant.
  • Reusable design for long-term professional use.
  • Suitable for BGA chip reballing and motherboard repair.
  • Delivers clean, precise, and reliable soldering results.

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