Amaoe E8535 Stencil

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SKU 178427831782185
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The Amaoe E8535 Stencil is a high-precision BGA reballing stencil designed for eMMC, eMCP, and storage IC chip repair. Manufactured from premium Japanese stainless steel with a precision 0.12mm thickness, it provides excellent durability, precise alignment, and consistent solder ball placement for professional motherboard repair work.

Featuring advanced laser-cut apertures, the E8535 stencil ensures accurate solder paste application and reliable reballing performance. It is ideal for repairing storage ICs commonly found in smartphones, tablets, and other electronic devices. The stencil is reusable, heat-resistant, and suitable for professional BGA and SMD rework applications.

Features:

  • Premium Japanese stainless steel construction
  • Precision 0.12mm thickness
  • Designed for eMMC and eMCP IC reballing
  • High-precision laser-cut aperture design
  • Accurate solder ball positioning
  • Reusable and heat-resistant
  • Ideal for smartphone motherboard repair
  • Suitable for professional BGA and SMD rework

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