AMAOE BS2 BGA Reballing Stencil for Mobile CPU & IC Repair

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SKU 178419020889821
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The AMAOE BS2 BGA Reballing Stencil is a premium-quality stainless steel stencil engineered for accurate reballing of mobile phone CPU and IC chips. Featuring precision laser-cut holes, it ensures perfect solder ball alignment for efficient BGA chip repair, IC replacement, and motherboard maintenance.

Manufactured from durable stainless steel, the BS2 stencil is resistant to heat and corrosion, allowing repeated use without losing accuracy. It is an essential tool for professional mobile repair technicians performing advanced motherboard repairs and BGA rework.

Features:

  • Precision laser-cut stainless steel construction
  • Designed for mobile CPU and IC BGA reballing
  • Accurate solder ball placement for reliable repairs
  • Heat-resistant and corrosion-resistant
  • Reusable and durable for long-term use
  • Ideal for motherboard repair and IC replacement
  • Suitable for professional mobile repair workshops

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