The Amaoe BS-1 Stencil is a professional-grade BGA reballing stencil designed for precision rework of Qualcomm CPUs, Power Management ICs (PMICs), RF ICs, and other smartphone motherboard components. Made from premium Japanese stainless steel, it features a precision laser-cut square-hole design that ensures accurate solder ball placement and consistent reballing performance.
With a 0.12 mm thickness, high heat resistance, and reusable construction, the BS-1 stencil is ideal for advanced motherboard repairs and chip-level servicing. It is suitable for professional mobile repair technicians and service centers requiring reliable and precise IC reballing. The stencil supports a range of Qualcomm chipsets and ICs, including SM8350, SM8250, PM8350, PM8150A/B, PM8250, PMX55, WCD9380, WCN6851, SDX55M, SMB1396, and other compatible BGA components.
Key Features:
- Designed for Qualcomm CPU, PMIC, and RF IC reballing
- Premium Japanese stainless steel construction
- Precision laser-cut square-hole design
- 0.12 mm thickness for accurate solder ball placement
- Heat-resistant, durable, and reusable
- Compatible with multiple Qualcomm chipsets and power ICs
- Ideal for smartphone motherboard and PCB repair
- Suitable for professional mobile repair technicians and service centers
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