AMAOE BCM1 Bluetooth WiFi IC Universal Reballing Stencil
The AMAOE BCM1 Bluetooth WiFi IC Universal Reballing Stencil is a professional-grade BGA reballing stencil designed for repairing and reballing a wide range of Broadcom (BCM) WiFi and Bluetooth ICs used in smartphones, tablets, and other electronic devices. Manufactured from premium Japanese stainless steel with a 0.12mm thickness, it provides precise solder ball alignment for accurate and reliable chip-level repairs.
The stencil features multiple dedicated BGA layouts for commonly used Broadcom WiFi/Bluetooth ICs along with a universal 0.4mm pitch 18×18mm positioning area, allowing technicians to service compatible ICs efficiently. Its reusable, heat-resistant construction makes it ideal for professional repair shops and mobile motherboard technicians.
Supported Broadcom ICs:
- BCM4330
- BCM4334
- BCM43340
- BCM43341
- BCM4339
- BCM4343
- BCM43438
- BCM43455
- BCM4354
- BCM4355
- BCM4356
- BCM43596
- BCM4773
- BCM4774
- Universal 0.4mm × 18×18mm BGA positioning area for compatible ICs.
Features:
- Designed for Broadcom Bluetooth & WiFi IC reballing.
- Premium Japanese stainless steel construction.
- Precision 0.12mm thickness.
- Universal 0.4mm × 18×18mm positioning area.
- High-precision laser-cut square-hole design.
- Heat-resistant, corrosion-resistant, and reusable.
- Ideal for professional BGA chip and motherboard repair.
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