AMAOE 1+13-012 Mid Layer Network BGA Reballing Stencil for OnePlus 13

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SKU 178400973915080
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The AMAOE 1+13-012 Mid Layer Network BGA Reballing Stencil is a precision-engineered repair stencil designed specifically for the OnePlus 13 smartphone. It is intended for Network IC (Baseband) reballing and mid-layer motherboard repairs, making it an essential tool for professional mobile phone technicians.

Manufactured from premium-grade stainless steel, this stencil features precision laser-cut holes for accurate solder ball placement, ensuring reliable and efficient IC rework. Its durable, heat-resistant construction allows for repeated use while maintaining excellent alignment during chip-level repairs.

Key Features:

  • Designed for OnePlus 13 Mid Layer Network IC repair
  • Model: AMAOE 1+13-012
  • High-quality stainless steel construction
  • Precision laser-cut BGA hole pattern
  • Ideal for Network IC reballing and motherboard repair
  • Heat-resistant, durable, and reusable
  • Suitable for professional mobile repair workshops

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