KOOCU 422 BGA Flux Paste is a premium quality no-clean soldering flux specially designed for mobile motherboard repair, IC reballing, BGA rework, and precision soldering jobs. It provides strong activity, smooth tinning, and excellent solder flow for high-accuracy electronic repairs. Its halogen-free formula ensures minimal residue and better insulation protection, making it ideal for mobile technicians and electronic repair professionals.
Suitable for CPU, IC, BGA, SMD, and PCB soldering applications. KOOCU 422 improves solder joint quality, reduces oxidation, and enhances heat transfer during repair work.
Key Features:
• High activity for faster soldering
• Smooth and clean tinning performance
• No-clean and low residue formula
• Strong viscosity and stable performance
• Suitable for BGA, CPU, IC, PCB repair
• Ideal for mobile repair technicians
• Halogen-free and safe formulation
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