YCS CPU IC BGA Tin Planting Arc Pad with Magnetic Base

The YCS CPU IC BGA Tin Planting Arc Pad with Magnetic Base is a professional reballing and soldering aid designed for CPU, IC, and BGA chip repair. Engineered to provide a stable working platform during tin planting and reballing operations, the arc-shaped pad helps technicians achieve accurate solder ball placement and improved repair efficiency. The integrated magnetic base securely holds the pad in position, reducing movement and enhancing precision during delicate repair tasks. Made from heat-resistant materials, it is ideal for motherboard repair, BGA chip rework, CPU maintenance, and advanced electronics servicing.

Key Features:

• Designed for CPU, IC, and BGA tin planting operations.
• Magnetic base for enhanced stability during repair.
• Arc-shaped design improves solder ball placement accuracy.
• Heat-resistant construction for professional rework applications.
• Suitable for BGA reballing and chip repair.
• Helps reduce component movement during soldering.
• Durable and reusable design.
• Ideal for mobile phone motherboard repair.
• Professional-grade tool for electronics technicians.

Specifications:

• Brand: YCS
• Product Type: Tin Planting Arc Pad
• Base Type: Magnetic Base
• Application: CPU, IC & BGA Reballing
• Material: Heat-Resistant Alloy Construction
• Usage: Solder Ball Planting & Rework
• Weight: 0.25 Kg

Applications:

• CPU reballing operations
• IC chip repair
• BGA solder ball planting
• Mobile motherboard repair
• PCB rework projects
• Electronics maintenance
• Professional repair workshops