YCS 2S Chip Heating Platform for Glue Removal & Mobile IC Repair

YCS 2S Heating Platform, Chip Heating Table, Glue Removal Heating Platform, IC Repair Tool, PCB Preheater, Mobile Repair Heating Station, BGA Rework Tool, Motherboard Repair Equipment, Chip Removal Tool, YCS Heating Platform

Product Description:
The YCS 2S Chip Heating Platform is a professional preheating and glue removal tool designed for mobile phone motherboard repair, IC replacement, and BGA rework applications. Featuring a high-efficiency heating system with precise temperature control, it provides uniform heat distribution to safely soften underfill glue and adhesive around CPU, IC, and chipset components. The compact and durable design ensures stable operation while minimizing the risk of PCB deformation during repair. Ideal for mobile repair technicians, the YCS 2S heating platform improves repair efficiency and precision during chip removal, motherboard maintenance, and advanced micro-soldering work.

Key Features:

• Professional heating platform for chip and IC repair.
• Designed for glue removal and underfill softening.
• Uniform heat distribution across the working surface.
• Precise temperature control for safe operation.
• Reduces PCB stress during chip removal procedures.
• Suitable for CPU, IC, chipset, and motherboard repairs.
• Compact and durable metal construction.
• Improves repair efficiency and accuracy.
• Ideal for professional mobile repair workshops.

Specifications:

• Brand: YCS
• Model: 2S
• Product Type: Chip Heating Platform
• Function: Glue Removal & PCB Preheating
• Heating Type: Constant Temperature Heating
• Application: Mobile Motherboard & IC Repair
• Weight: 0.65 Kg

Applications:

• IC chip removal
• CPU repair and replacement
• Underfill glue softening
• PCB preheating
• Mobile motherboard repair
• BGA rework operations
• Electronics repair workshops