MECHANIC ZW50 Special Solder Paste for Chip Tin Planting

The MECHANIC ZW50 Special Solder Paste for Chip Tin Planting is a high-performance solder paste specially developed for BGA chip tin planting, IC reballing, PCB repair, and precision electronic soldering. With a melting point of 183°C, it provides smooth solder flow, excellent wetting performance, and strong, reliable solder joints for professional repair applications.

Its fine solder particles ensure precise application on BGA chips, CPUs, ICs, and SMD components, making it ideal for mobile phone motherboard repairs, laptop repairs, gaming consoles, and other advanced electronic devices. The premium formulation minimizes oxidation, reduces solder ball defects, and improves overall soldering efficiency.

Key Features

• Professional solder paste for chip tin planting
• Ideal for BGA, CPU, IC, and SMD reballing
• Low melting point of approximately 183°C
• Excellent solder wetting and flow performance
• Produces strong and reliable solder joints
• Fine solder particles for precision work
• Reduces oxidation and solder ball defects
• Suitable for PCB repair and motherboard maintenance
• Easy to apply for professional technicians
• Compatible with precision electronic repair applications

Specifications

• Brand: MECHANIC
• Model: ZW50
• Product Type: Solder Paste
• Application: Chip Tin Planting, BGA Reballing, CPU Repair, PCB Repair
• Melting Point: 183°C
• Suitable For: BGA Chips, ICs, CPUs, SMD Components
• Usage: Mobile Phone Repair, Laptop Repair, Motherboard Repair, Electronic Assembly
• Features: High Activity, Smooth Solder Flow, Strong Bonding, Low Oxidation