Luowei LW-SP1 High Quality Low Temperature Solder Paste 138°C

The Luowei LW-SP1 High Quality 138°C Solder Paste is a professional low-temperature soldering paste specially formulated for precision electronics repair, motherboard maintenance, BGA rework, and mobile phone servicing. Its low melting point allows technicians to perform delicate repair work while reducing the risk of heat damage to sensitive components.

Manufactured with fine solder particles and advanced flux technology, the LW-SP1 delivers excellent wetting performance, smooth solder flow, strong solder joints, and minimal residue after use. It is ideal for IC replacement, BGA chip rework, connector repairs, jumper wire soldering, and precision PCB maintenance.

Designed for professional technicians and repair centers, this high-performance solder paste improves repair efficiency and ensures reliable electrical connections in advanced electronic repair applications.

Key Features:

• Premium low-temperature solder paste
• Melting point: 138°C
• Excellent solderability and wetting performance
• Smooth and uniform solder flow
• Strong and durable solder joints
• Low residue after soldering
• Suitable for delicate electronic components
• Ideal for BGA, IC, CPU, and motherboard repairs
• Reduces thermal stress and heat damage
• High electrical conductivity
• Easy application and rework
• Suitable for professional repair workshops

Applications:

• Mobile phone motherboard repair
• BGA chip reballing and rework
• PCB maintenance and soldering
• IC chip replacement
• Connector and flex cable repairs
• Precision electronics assembly and repair