Luowei LW-SP1 High Quality Lead-Free Solder Paste 217°C (50g)

The Luowei LW-SP1 217°C Lead-Free Solder Paste is a premium-quality soldering material specially formulated for PCB repair, motherboard maintenance, BGA rework, and precision electronics assembly. Featuring a melting temperature of 217°C, this lead-free solder paste delivers excellent solderability, strong bonding strength, and reliable electrical conductivity for professional repair applications.

Manufactured with fine solder powder and high-performance flux, the LW-SP1 ensures smooth solder flow, excellent wetting performance, and minimal residue after soldering. Its lead-free formulation makes it environmentally friendly while maintaining superior mechanical strength and durability.

Ideal for mobile phone repair technicians, electronics engineers, and repair centers, this solder paste is suitable for IC replacement, connector repair, BGA chip rework, motherboard servicing, and PCB assembly work.

Key Features:

• High-quality lead-free solder paste
• Melting temperature: 217°C
• Excellent solderability and wetting performance
• Smooth and uniform solder flow
• Strong and durable solder joints
• Lead-free and environmentally friendly formula
• High electrical conductivity
• Low residue after soldering
• Suitable for BGA, IC, CPU, and motherboard repairs
• Ideal for PCB assembly and maintenance
• Professional repair-grade quality
• Easy application and storage

Applications:

• Mobile phone motherboard repair
• PCB assembly and rework
• BGA chip replacement
• IC soldering and repair
• Connector and charging port repairs
• Electronics manufacturing and maintenance