The Amaoe U-QSD5 Stencil is a high-precision BGA reballing stencil designed for Qualcomm chipset repair and smartphone motherboard maintenance. Manufactured from premium Japanese stainless steel with a precision laser-cut design, it ensures accurate solder ball placement for reliable IC reballing and repair. The reusable stencil offers excellent heat resistance, durability, and consistent performance, making it an essential tool for professional mobile repair technicians and electronics service centers. It features a 0.12 mm thickness and precision square apertures for accurate solder paste application and chip reballing.
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