2UUL BH11 Universal Phone Board Mid Frame Reballing Magnetic Platform

2UUL BH11 Universal Phone Board Mid Frame Reballing Magnetic Platform is a professional-grade motherboard holding fixture designed for mobile phone repair technicians. The platform features a powerful magnetic positioning system that securely holds phone motherboards, IC chips, and reballing stencils during soldering and BGA rework operations.

Manufactured from high-temperature resistant material, the BH11 platform allows direct hot air gun operation without deformation. Its universal design supports a wide range of smartphone motherboards, including iPhone, Samsung, Xiaomi, Vivo, Oppo, Realme, and other Android devices.

The strong magnetic adsorption ensures precise alignment between the stencil and motherboard, making solder paste application and tin planting easier and more accurate. Dual-depth grooves support different motherboard thicknesses, while the compact design makes it suitable for professional repair shops and advanced technicians.

Key Features:
• Universal phone motherboard reballing magnetic platform.
• Strong magnetic automatic positioning system.
• High-precision alignment for BGA reballing.
• High-temperature resistant construction.
• Suitable for CPU, IC, NAND, and motherboard repairs.
• Compatible with iPhone and Android devices.
• Durable and long-lasting professional repair tool.
• Compact and lightweight design for easy handling.

Package Includes:
• 1 x 2UUL BH11 Magnetic Reballing Platform
• 2 x Positioning Scrapers